{
  "source_id": "cls",
  "url": "https://www.cls.cn/detail/2401429",
  "url_hash": "9612490c1f27dfcf",
  "title": "加速切入硬科技投资，燧原科技、粤芯半导体IPO浮现多家银行身影",
  "publish_time": "2026-06-16T19:26:00",
  "event": {
    "stock_codes": [],
    "company_names": [
      "燧原科技",
      "粤芯半导体",
      "农业银行",
      "建设银行",
      "兴业银行",
      "中信银行"
    ],
    "industries": [
      "半导体",
      "GPU",
      "晶圆制造"
    ],
    "sentiment": "neutral",
    "importance": 3,
    "event_type": "其他",
    "summary": "燧原科技与粤芯半导体过会，背后多家银行资金参与投资，银行系资本加速布局半导体产业链。"
  },
  "provider": "deepseek",
  "model": "deepseek-chat",
  "extracted_at": "2026-06-17T06:36:44.365174",
  "attempts": 1,
  "prompt_tokens": 2318,
  "completion_tokens": 112
}