{
  "source_id": "cls",
  "url": "https://www.cls.cn/detail/2400912",
  "url_hash": "4bbf9d542a87d0f1",
  "title": "适配高堆叠闪存芯片生产 应用材料推出两款“3D微缩”设备",
  "publish_time": "2026-06-16T13:29:00",
  "event": {
    "stock_codes": [],
    "company_names": [
      "应用材料"
    ],
    "industries": [
      "半导体设备"
    ],
    "sentiment": "neutral",
    "importance": 3,
    "event_type": "产品发布",
    "summary": "应用材料推出两款面向3D芯片微缩技术的新设备，用于先进芯片制造的沉积与刻蚀环节，已获头部客户采用。"
  },
  "provider": "deepseek",
  "model": "deepseek-chat",
  "extracted_at": "2026-06-17T06:36:41.666478",
  "attempts": 1,
  "prompt_tokens": 2075,
  "completion_tokens": 87
}