Initial commit

2026-07-18 15:51:01 +08:00
commit f2c80c5a9c
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+{
+  "source_id": "cls",
+  "url": "https://www.cls.cn/detail/2400912",
+  "url_hash": "4bbf9d542a87d0f1",
+  "title": "适配高堆叠闪存芯片生产 应用材料推出两款“3D微缩”设备",
+  "publish_time": "2026-06-16T13:29:00",
+  "event": {
+    "stock_codes": [],
+    "company_names": [
+      "应用材料"
+    ],
+    "industries": [
+      "半导体设备"
+    ],
+    "sentiment": "neutral",
+    "importance": 3,
+    "event_type": "产品发布",
+    "summary": "应用材料推出两款面向3D芯片微缩技术的新设备，用于先进芯片制造的沉积与刻蚀环节，已获头部客户采用。"
+  },
+  "provider": "deepseek",
+  "model": "deepseek-chat",
+  "extracted_at": "2026-06-17T06:36:41.666478",
+  "attempts": 1,
+  "prompt_tokens": 2075,
+  "completion_tokens": 87
+}