Initial commit

2026-07-18 15:51:01 +08:00
commit f2c80c5a9c
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+{
+  "source_id": "cls",
+  "url": "https://www.cls.cn/detail/2401429",
+  "url_hash": "9612490c1f27dfcf",
+  "title": "加速切入硬科技投资，燧原科技、粤芯半导体IPO浮现多家银行身影",
+  "publish_time": "2026-06-16T19:26:00",
+  "event": {
+    "stock_codes": [],
+    "company_names": [
+      "燧原科技",
+      "粤芯半导体",
+      "农业银行",
+      "建设银行",
+      "兴业银行",
+      "中信银行"
+    ],
+    "industries": [
+      "半导体",
+      "GPU",
+      "晶圆制造"
+    ],
+    "sentiment": "neutral",
+    "importance": 3,
+    "event_type": "其他",
+    "summary": "燧原科技与粤芯半导体过会，背后多家银行资金参与投资，银行系资本加速布局半导体产业链。"
+  },
+  "provider": "deepseek",
+  "model": "deepseek-chat",
+  "extracted_at": "2026-06-17T06:36:44.365174",
+  "attempts": 1,
+  "prompt_tokens": 2318,
+  "completion_tokens": 112
+}