26 lines
796 B
JSON
26 lines
796 B
JSON
{
|
|
"source_id": "cls",
|
|
"url": "https://www.cls.cn/detail/2400912",
|
|
"url_hash": "4bbf9d542a87d0f1",
|
|
"title": "适配高堆叠闪存芯片生产 应用材料推出两款“3D微缩”设备",
|
|
"publish_time": "2026-06-16T13:29:00",
|
|
"event": {
|
|
"stock_codes": [],
|
|
"company_names": [
|
|
"应用材料"
|
|
],
|
|
"industries": [
|
|
"半导体设备"
|
|
],
|
|
"sentiment": "neutral",
|
|
"importance": 3,
|
|
"event_type": "产品发布",
|
|
"summary": "应用材料推出两款面向3D芯片微缩技术的新设备，用于先进芯片制造的沉积与刻蚀环节，已获头部客户采用。"
|
|
},
|
|
"provider": "deepseek",
|
|
"model": "deepseek-chat",
|
|
"extracted_at": "2026-06-17T06:36:41.666478",
|
|
"attempts": 1,
|
|
"prompt_tokens": 2075,
|
|
"completion_tokens": 87
|
|
} |