33 lines
925 B
JSON
33 lines
925 B
JSON
{
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"source_id": "cls",
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"url": "https://www.cls.cn/detail/2401429",
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"url_hash": "9612490c1f27dfcf",
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"title": "加速切入硬科技投资，燧原科技、粤芯半导体IPO浮现多家银行身影",
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"publish_time": "2026-06-16T19:26:00",
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"event": {
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"stock_codes": [],
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"company_names": [
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"燧原科技",
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"粤芯半导体",
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"农业银行",
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"建设银行",
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"兴业银行",
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"中信银行"
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],
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"industries": [
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"半导体",
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"GPU",
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"晶圆制造"
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],
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"sentiment": "neutral",
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"importance": 3,
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"event_type": "其他",
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"summary": "燧原科技与粤芯半导体过会，背后多家银行资金参与投资，银行系资本加速布局半导体产业链。"
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},
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"provider": "deepseek",
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"model": "deepseek-chat",
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"extracted_at": "2026-06-17T06:36:44.365174",
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"attempts": 1,
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"prompt_tokens": 2318,
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"completion_tokens": 112
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} |